Thermo-mechanical evaluation of 3D packages
- Sayuri Kohara
- Akihiro Horibe
- et al.
- 2013
- 3DIC 2013
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3 results at 3DIC 2013
Integration of intra chip stack fluidic cooling using thin-layer solder bonding
- Yassir Madhour
- Michael Zervas
- et al.
- 2013
- 3DIC 2013
Thermal design guideline and new cooling solution for a three-dimensional (3D) chip stack
- Keiji Matsumoto
- Soichiro Ibaraki
- et al.
- 2013
- 3DIC 2013