Formulation of percolating thermal underfills using hierarchical self-assembly of micro- and nanoparticles by centrifugal forces and capillary bridging
- Thomas Brunschwiler
- Gerd Schlottig
- et al.
- 2012
- IMAPS 2012
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3 results at IMAPS 2012
Effect of preformed IMC layer on electromigration of solder capped cu pillar bump interconnection on an organic substrate
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2012
- IMAPS 2012
Assessment of XRF technique as a method to measure percent ag in SnAg solders for flip chip applications
- Jennifer D. Schuler
- Chia-Hsin Shih
- et al.
- 2012
- IMAPS 2012