Experimental study of copper leveling additives and their wafer and pattern-scale effect on copper planarization
- James Kelly
- Charan Surisetty
- et al.
- 2013
- Comptes Rendus Chimie
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Adhesion enhancement of polymer blend interfaces by reactive block copolymer brushes
- Wenchun Hu
- Hugh R. Brown
- et al.
- 2006
- Comptes Rendus Chimie