Stephan Paredes  Stephan Paredes photo         

contact information

Senior Engineer - Advanced Thermal Packaging
Zurich Research Laboratory, Zurich, Switzerland



Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587

Aquasar: A hot water cooled data center with direct energy reuse
S. Zimmermann, G. I. Meijer, M. K. Tiwari, S. Paredes, B. Michel, D. Poulikakos
Energy 43, 237, 2012


Flow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
Yassir Madhour, Jonathan Olivier, Etienne Costa-Patry, Stephan Paredes, Bruno Michel, John Richard Thome
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1(6), 873--883, IEEE, 2011

Ultra-High-Concentration Photovoltaic-Thermal Systems Based on Microfluidic Chip-Coolers
M. Müller, W. Escher, R. Ghannam, J. Goicochea, B. Michel, C.L. Ong, S. Paredes, F. Dimroth, S. Kurtz, G. Sala,
AIP Conference Proceedings-American Institute of Physics, pp. 231, 2011

Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011

Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124


Zero-emission datacenters and 3D chip stacking
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010

Advanced liquid cooling for concentrated photovoltaic electro-thermal co-generation
Werner Escher, Rami Ghannam, Ahmed Khalil, Stephan Paredes, Bruno Michel
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on, pp. 9--17

Heat-removal performance scaling of interlayer cooled chip stacks
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010


Validation of the Porous-medium Approach to Model Interlayer-cooled 3D-chip Stacks
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10

Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156