Stephan Paredes 
contact information
Senior Engineer - Advanced Thermal PackagingZurich Research Laboratory, Zurich, Switzerland +41
447248481
447248481 links
2012
Extended tensor description to design non-uniform heat-removal in interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on, pp. 574--587
Aquasar: A hot water cooled data center with direct energy reuse
S. Zimmermann, G. I. Meijer, M. K. Tiwari, S. Paredes, B. Michel, D. Poulikakos
Energy 43, 237, 2012
S. Zimmermann, G. I. Meijer, M. K. Tiwari, S. Paredes, B. Michel, D. Poulikakos
Energy 43, 237, 2012
A novel concept of energy reuse from high concentration photovoltaic thermal (HCPVT) system for desalination
Chin Lee Ong, W Escher, S Paredes, ASG Khalil, B Michel
Desalination295, 70--81, Elsevier, 2012
Chin Lee Ong, W Escher, S Paredes, ASG Khalil, B Michel
Desalination295, 70--81, Elsevier, 2012
2011
Flow boiling of R134a in a multi-microchannel heat sink with hotspot heaters for energy-efficient microelectronic CPU cooling applications
Yassir Madhour, Jonathan Olivier, Etienne Costa-Patry, Stephan Paredes, Bruno Michel, John Richard Thome
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1(6), 873--883, IEEE, 2011
Yassir Madhour, Jonathan Olivier, Etienne Costa-Patry, Stephan Paredes, Bruno Michel, John Richard Thome
Components, Packaging and Manufacturing Technology, IEEE Transactions on 1(6), 873--883, IEEE, 2011
Ultra-High-Concentration Photovoltaic-Thermal Systems Based on Microfluidic Chip-Coolers
M. Müller, W. Escher, R. Ghannam, J. Goicochea, B. Michel, C.L. Ong, S. Paredes, F. Dimroth, S. Kurtz, G. Sala,
AIP Conference Proceedings-American Institute of Physics, pp. 231, 2011
M. Müller, W. Escher, R. Ghannam, J. Goicochea, B. Michel, C.L. Ong, S. Paredes, F. Dimroth, S. Kurtz, G. Sala,
AIP Conference Proceedings-American Institute of Physics, pp. 231, 2011
Toward five-dimensional scaling: How density improves efficiency in future computers
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011
P Ruch, T Brunschwiler, W Escher, S Paredes, B Michel
IBM Journal of Research and Development 55(5), 15:1--13, IBM, 2011
Angle-of-attack investigation of pin-fin arrays in nonuniform heat-removal cavities for interlayer cooled chip stacks
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124
T Brunschwiler, S Paredes, U Drechsler, B Michel, B Wunderle, H Reichl
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM), 2011 27th Annual IEEE, pp. 116--124
2010
Zero-emission datacenters and 3D chip stacking
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010
T. Brunschwiler, G. I. Meijer, S. Paredes, W. Escher, B. Michel
International Conference on Thermal Issues in Emerging Technologies Theory and Applications, pp. 3--3, 2010
Advanced liquid cooling for concentrated photovoltaic electro-thermal co-generation
Werner Escher, Rami Ghannam, Ahmed Khalil, Stephan Paredes, Bruno Michel
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on, pp. 9--17
Werner Escher, Rami Ghannam, Ahmed Khalil, Stephan Paredes, Bruno Michel
Thermal Issues in Emerging Technologies Theory and Applications (ThETA), 2010 3rd International Conference on, pp. 9--17
Heat-removal performance scaling of interlayer cooled chip stacks
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010
T. Brunschwiler, S. Paredes, U. Drechsler, B. Michel, W. Cesar, Y. Leblebici, B. Wunderle, H. Reichl
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, pp. 1, 2010
2009
Validation of the Porous-medium Approach to Model Interlayer-cooled 3D-chip Stacks
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10
Thomas Brunschwiler, Stephan Paredes, Ute Drechsler, Bruno Michel, W Cesar, G Toral, Yuksel Temiz, Yusuf Leblebici
3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, pp. 1--10
Hotspot-adapted cold plates to maximize system efficiency
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156
Thomas Brunschwiler, Hugo Rothuizen, Stephan Paredes, B Michel, Evan Colgan, Pepe Bezama
Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on, pp. 150--156