Stephan Paredes 
contact information
Senior Engineer - Advanced Thermal PackagingZurich Research Laboratory, Zurich, Switzerland +41
447248481
447248481 links
2013
Thermal power plane for integrated circuits
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,427,833
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,427,833
Optimized semiconductor packaging in a three-dimensional stack
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,476,112
Harry Barowski, Thomas Brunschwiler, Hubert Harrer, Andreas Huber, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper
US Patent 8,476,112
2012
Heat Sink Integrated Power Delivery and Distribution for Integrated Circuits
H. Barowski, T. Brunschwiler, H. Harrer, A. Huber, B. Michel, T. Niggemeier, S. Paredes, J. Supper
US Patent 20,120,106,074
H. Barowski, T. Brunschwiler, H. Harrer, A. Huber, B. Michel, T. Niggemeier, S. Paredes, J. Supper
US Patent 20,120,106,074
2011
Integrated circuit package connected to a data transmission medium
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,327
Harry Barowski, Thomas Brunschwiler, Roger F Dangel, Hubert Harrer, Andreas Huber, Norbert M Meier, Bruno Michel, Tim Niggemeier, Stephan Paredes, Jochen Supper, others
US Patent App. 13/312,327