Carl Radens

Memory Research for Hybrid Cloud, Systems and AI

Focused on the R&D of cache memory used in computer chips, high-performance processors, AI, hybrid cloud, mobile communication, system-on-chip (SoC), entertainment processors, graphics processors, and ASICs, for foundry, platform and custom applications.

https://www.linkedin.com/in/carlradens/

h-index = 46 overall, >9679 citations

https://scholar.google.com/citations?hl=en&user=6bLa6jIAAAAJ

> 390 issued US patents

http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO2&Sect2=HITOFF&p=1&u=%2Fnetahtml%2FPTO%2Fsearch-bool.html&r=0&f=S&l=50&TERM1=radens&FIELD1=INNM&co1=AND&TERM2=&FIELD2=&d=PTXT

IEEE Author Profile (subset of publications)

https://ieeexplore.ieee.org/author/37331431800

Selected Publications (also see LinkedIn profile):

• High-Performance Nanosheet Technology Optimized for 77 K, IEDM 2023
• Performance of stacked nanosheet gate all around FET’s with EUV patterned gate and sheets, 2021
• A comparative analysis of EUV sheet and gate patterning for beyond 7nm gate all around stacked nanosheet FET’s, 2020
• Extrinsic Device and Leakage Mechanism in Advanced Bulk FinFET SRAM, 2019
• A 7nm CMOS Technology Platform for Mobile and High Performance Compute Application, 2017
• A Universal Hardware-Driven PVT and Layout-Aware Predictive Failure Analytics for SRAM, 2016
• 'Super-Fast Physics-based Methodology for Accurate Memory Yield Prediction', 2015
• High Performance 14nm SOI FinFET CMOS Technology with 0.0174um2 embedded DRAM and 15 Levels of Cu Metallization, 2014
• Fully-depleted planar technologies and static RAM
• A 64Mb SRAM in 32nm High-k metal-gate SOI technology with 0.7V operation enabled by stability, write-ability and read-ability enhancements
• Embedded memory considerations in SOI
• A 45nm low power bulk technology featuring carbon co-implantation and laser anneal on 45°-rotated substrate
• A Sub-600-mV, Fluctuation Tolerant 65-nm CMOS SRAM Array With Dynamic Cell Biasing
• Are Design Tools and Methodologies Measuring up to the Challenges of the DFM Era?
• Characterization of across-device linewidth variation (ADLV) for 65-nm logic SRAM using CDSEM and linewidth roughness algorithms
• Fluctuation limits & scaling opportunities for CMOS SRAM cells
• High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
• Technologies for scaling vertical transistor DRAM cells to 70 nm
• Challenges and future directions for the scaling of dynamic random-access memory (DRAM)
• Leakage current and reliability evaluation of ultra-thin reoxidized nitride and comparison with silicon dioxides
• A highly cost efficient 8F/sup 2/ DRAM cell with a double gate vertical transistor device for 100 nm and beyond
• A lithographically-friendly 6F2 DRAM cell
• + more

Honors & Awards

• Outstanding Research Accomplishment: Technology Development, Qualificaiton, and Design Technology Co-Optimization for 7nm Server Processors, 2021
• Invention Achievement Award 100th Plateau, 2020
• Excellence and Eminence Award, 2019
• Lifetime Master Inventor
• Outstanding Technical Achievement Award in Appreciation for 45 nm Bulk Technology Development
• Outstanding Technical Achievement Award in Appreciation for P6 Worlds Fastest Processor
• Corporate Technical Recognition Event (CTRE) 3X
• Division Portfolio Awards for High-Value Patents (17X)