B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
Progress in scaling of MOS transistors and integrated circuits over the years is reviewed and today's status and challenges are described. Generalized scaling is updated for the present leakage-constrained environment to project results of continued scaling at a constant power-supply voltage. Alternatives to achieve energy-efficient operation at lower voltages are discussed. Particular attention is given to threshold variability issues and to the design challenges in reducing and controlling variability using back-gate devices. The importance of the depth of the inversion layer below the silicon surface as a limit to the effectiveness of gate-insulator scaling is illustrated by a design study. Low-temperature operation is considered as a possible future direction for continuing scaling. © 2007 Elsevier Ltd. All rights reserved.
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
J.H. Stathis, R. Bolam, et al.
INFOS 2005
Eloisa Bentivegna
Big Data 2022