Thermal Design & Performance of 300 mm Wafer Scale System
Evan G. Colgan, Phillip Mann, et al.
ITherm 2024
This paper describes a practical implementation of a single-phase Si microchannel cooler designed for cooling very high power chips such as microprocessors. Through the use of multiple heat exchanger zones and optimized cooler fin designs, a unit thermal resistance 10.5 C-mm2W from the cooler surface to the inlet water was demonstrated with a fluid pressure drop of <35 kPa. Further, cooling of a thermal test chip with a micro channel cooler bonded to it packaged in a single chip module was also demonstrated for a chip power density greater than 300 W/cm2. Coolers of this design should be able to cool chips with average power densities of 400 W/cm2 or more. © 2007 IEEE.
Evan G. Colgan, Phillip Mann, et al.
ITherm 2024
Yoichi Taira, Daiju Nakano, et al.
EURODISPLAY 2002
Christian Schuster, Daniel M. Kuchta, et al.
IEEE Topical Meeting EPEPS 2003
Steven A. Rosenau, Jonathan Simon, et al.
OFC 2006