The over-bump applied resin wafer-level underfill process: Process, material and reliability
- Claudius Feger
- Nancy LaBianca
- et al.
- 2009
- ECTC 2009
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12 results for Nancy LaBianca
High performance and sub-ambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- ICNMM 2006
A practical implementation of silicon microchannel coolers for high power chips
- E.G. Colgan
- B.K. Furman
- et al.
- 2005
- SEMI-THERM 2005
High-aspect-ratio resist for thick-film applications
- N. LaBianca
- J. Gelorme
- 1995
- Microlithography 1995
Efficient waveguide-integrated tunnel junction detectors at 1.6 μm
- Philip C. D. Hobbs
- Robert B. Laibowitz
- et al.
- 2007
- Optics Express
A practical implementation of silicon microchannel coolers for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2007
- IEEE Transactions on Components and Packaging Technologies
High performance and subambient silicon microchannel cooling
- E.G. Colgan
- B.K. Furman
- et al.
- 2006
- Journal of Heat Transfer
Silicon microchannel cooling for high power chips
- Evan G. Colgan
- Bruce Furman
- et al.
- 2006
- HVAC and R Research
Development of conductive adhesive materials for via fill applications
- Sung K. Kang
- Stephen L. Buchwalter
- et al.
- 2001
- IEEE Transactions on Components and Packaging Technologies
SU-8: A low-cost negative resist for MEMS
- H. Lorenz
- M. Despont
- et al.
- 1999
- JMM