B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
This paper discusses a simplified "lift-off" process, which consists of two layers. This consists of an underlayer of soluble, thermally stable polyimide, and a new process, "silylation", which converts typical positive photoresists into oxygen RIE barriers. The uses of this new material and process for chip and packaging applications are described in this paper. © 1990.
B.A. Hutchins, T.N. Rhodin, et al.
Surface Science
Andreas C. Cangellaris, Karen M. Coperich, et al.
EMC 2001
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
O.F. Schirmer, K.W. Blazey, et al.
Physical Review B