Frank Stem
C R C Critical Reviews in Solid State Sciences
This paper discusses a simplified "lift-off" process, which consists of two layers. This consists of an underlayer of soluble, thermally stable polyimide, and a new process, "silylation", which converts typical positive photoresists into oxygen RIE barriers. The uses of this new material and process for chip and packaging applications are described in this paper. © 1990.
Frank Stem
C R C Critical Reviews in Solid State Sciences
S.F. Fan, W.B. Yun, et al.
Proceedings of SPIE 1989
J. Paraszczak, J.M. Shaw, et al.
Micro and Nano Engineering
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.