Conference paperEffects of overlayers on electromigration reliability improvement for Cu/low K interconnectsC.-K. Hu, D. Canaperi, et al.IRPS 2004
PaperImaging and analysis of subsurface Cu interconnects by detecting backscattered electrons in the scanning electron microscopeL. Gignac, M. Kawasaki, et al.Journal of Applied Physics
Conference paperTunable Workfunction for Fully Silicied Gates (FUSI) and Proposed MechanismsY.-H. Kim, C. Cabral Jr., et al.VLSI-TSA 2006
Conference paperBimodal electromigration mechanisms in dual-damascene Cu line/via on WC.-K. Hu, L. Gignac, et al.IITC 2002