PaperAtom motion of Cu and Co in Cu damascene lines with a CoWP capC.-K. Hu, L. Gignac, et al.Applied Physics Letters
Conference paperEffects of overlayers on electromigration reliability improvement for Cu/low K interconnectsC.-K. Hu, D. Canaperi, et al.IRPS 2004
PaperImproved energy analyser for the scanning electron microscopeO.C. Wells, C.G. BremerJournal of Physics E: Scientific Instruments