Conference paperA high performance phase change memory with fast switching speed and high temperature retention by engineering the Ge xSb yTe z phase change materialH.Y. Cheng, T.H. Hsu, et al.IEDM 2011
Conference paperEffects of overlayers on electromigration reliability improvement for Cu/low K interconnectsC.-K. Hu, D. Canaperi, et al.IRPS 2004
Conference paperDamascene copper integration impact on electomigration and stress migrationAnthony K. Stamper, H. Baks, et al.AMC 2005
Conference paperFilm crystallographic texture and substrate surface roughness in layered aluminum metallizationK.P. Rodbell, V. Svilan, et al.MRS Spring Meeting 1996
