Conference paperLow voltage, scalable nanocrystal FLASH memory fabricated by templated self assemblyK.W. Guarini, C.T. Black, et al.IEDM 2003
Conference paperImpact of Cu microstructure on electromigration reliabilityC.-K. Hu, L. Gignac, et al.IITC 2007
PaperComparison of electromigration in Cu interconnects with atomic-layer- or physical-vapor-deposited TaN linersC.-K. Hu, L. Gignac, et al.JES