A. Deutsch, H. Smith, et al.
IEEE Topical Meeting EPEPS 1997
A package structure involving two signal lines situated between a pair of mesh reference planes is solved using six different techniques ranging from static 2D to static 3D to full-wave 3D. Analysis methodology and code formulation is shown to yield results that closely agree among the approaches. In this paper, we demonstrate a suite of tools and a package analysis methodology that provides the user with the consistency in results needed to assure correct subsequent simulation.
A. Deutsch, H. Smith, et al.
IEEE Topical Meeting EPEPS 1997
Barry J. Rubin, D.N. De Araujo, et al.
IEEE Topical Meeting EPEPS 2002
I. Efrat, M. Tismenetsky, et al.
Journal of Computational Physics
L. Jiang, Barry J. Rubin, et al.
IEEE Topical Meeting EPEPS 2006