Massively parallel full-wave modeling of advanced packaging structures on BlueGene supercomputer
- J.D. Morsey
- L. Jiang
- et al.
- 2008
- ECTC 2008
Publications
Date
Featured collections
Popular topics
64 results for Barry J. Rubin
Efficient modeling methodology and hardware validation of glass-ceramic based wiring for high-performance single- And multi-chip modules
- Sungjun Chun
- Anand Haridass
- et al.
- 2005
- ECTC 2005
When are transmission-line effects important for on-chip interconnections
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1997
- ECTC 1997
Electrical modeling of extremely large packages
- Barry J. Rubin
- A. Mechentel
- et al.
- 1997
- ECTC 1997
Highly optimized and robust calculation of signal propagation parameters in electronic packages
- L. Efrat
- M. Tismenetsky
- et al.
- 1993
- ECTC 1993
Electrical modelling of temperature distributions in on-chip interconnects, packaging, and 3D integration
- Lijun Jiang
- Chuan Xu
- et al.
- 2010
- APEMC 2010
Electrical-thermal co-analysis for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- 3DIC 2009
Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration
- Jianyong Xie
- Daehyun Chung
- et al.
- 2009
- EPEPS 2009
Fast 3-D thermal analysis of complex interconnect structures using electrical modeling and simulation methodologies
- Chuan Xu
- Lijun Jiang
- et al.
- 2009
- ICCAD 2009
Thermal modeling of on-chip interconnects and 3D packaging using EM tools
- Lijun Jiang
- Seshadri Kolluri
- et al.
- 2008
- EPEPS 2008