Scalability of ultra-thin-body and BOX InGaAs MOSFETs on silicon
Lukas Czornomaz, N. Daix, et al.
ESSDERC 2013
We report CMOS-compatible n-channel InGaAs-on-insulator FinFETs obtained using a replacement metal gate fabrication flow. The fabricated devices feature 12-nm-thick SiNx spacers, a scaled high-k/metal gate (capacitance equivalent thickness of ∼ 1.5nm), raised source and drain doped to ∼ 6× 1019/cm3, and fin width scaled down to 15 nm. Very good control of short-channel effects is demonstrated down to a gate length of 50 nm with a minimum subthreshold swing of 92 mV/decade at VDS=0.5V and a drain-induced barrier lowering of 57 mV/V. An ON-state current (ION) of 156μA/μm is also reported for a supply voltage of 0.5 V and a fixed OFF-state current of 100 nA/μm. This ION value is the highest reported to date for CMOS-compatible InGaAs devices integrated on Si.
Lukas Czornomaz, N. Daix, et al.
ESSDERC 2013
Erik Cheah, Daniel Z. Haxell, et al.
Physical Review Materials
Clarissa Convertino, C. B. Zota, et al.
IEEE J-EDS
Svenja Mauthe, Philipp Staudinger, et al.
CLEO 2019