Conference paperHigh-performance three-dimensional on-chip inductors in SOI CMOS technology for monolithic RF circuit applicationsJonghae Kim, Jean-Olivier Plouchart, et al.RFIC 2003
PaperWhen are transmission-line effects important for on-chip interconnections?Alina Deutsch, Gerard V. Kopcsay, et al.IEEE T-MTT
PaperDevelopment of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnectionJohn U. Knickerbocker, Paul S. Andry, et al.IBM J. Res. Dev
PaperEffective crosstalk isolation through p+ Si substrates with semi-insulating porous SiHan-Su Kim, Keith A. Jenkins, et al.IEEE Electron Device Letters