Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
We review the use of dislocation modeling as a practical tool in the development of semiconducting devices. Areas of application include calculation of single dislocation behavior in transistors and memory cells, large-scale simulations of relaxation in SiGe/Si and SiGe/SOI layer systems, and investigation of dislocation nucleation at stress concentrators. Current capabilities and case studies for each are reviewed, and areas where further progress is needed are identified. © 2005 Elsevier B.V. All rights reserved.
Douglass S. Kalika, David W. Giles, et al.
Journal of Rheology
D.D. Awschalom, J.-M. Halbout
Journal of Magnetism and Magnetic Materials
J.R. Thompson, Yang Ren Sun, et al.
Physica A: Statistical Mechanics and its Applications
Corneliu Constantinescu
SPIE Optical Engineering + Applications 2009