Reflective nematic LC devices for LCOS applications
Minhua Lu, K.H. Yang
EURODISPLAY 2000
Electromigration kinetics of Pb-free solder bump interconnects have been studied using a single bump parameter sweep technique. By removing bump to bump variations in structure, texture, and composition, the single bump sweep technique has provided both activation energy and power exponents that reflect atomic migration and interface reactions with fewer samples, shorter stress time, and better statistics than standard failure testing procedures. Contact metallurgies based on Cu and Ni have been studied. Critical current, which corresponds to the Blech limit, was found to exist in the Ni metallurgy, but not in the Cu metallurgy. A temperature dependence of critical current was also observed. © 2014 AIP Publishing LLC.
Minhua Lu, K.H. Yang
EURODISPLAY 2000
Mikhail Treger, Christian Witt, et al.
Journal of Applied Physics
Conal E. Murray, Mikhail Treger, et al.
IEEE T-DMR
Minhua Lu, K.H. Yang, et al.
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers