Influence of UBM metallurgy on Sn textures and em failure
- Minhua Lu
- Hongqing Zhang
- 2015
- ECTC 2015
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44 results for Minhua Lu
Electromigration and thermal migration in Pb-free interconnects
- Minhua Lu
- Thomas Wassick
- et al.
- 2015
- ECTC 2015
Effect of Ag and Cu content in Sn based Pb-free solder on electromigration
- Minhua Lu
- Charles Goldsmith
- et al.
- 2014
- ECTC 2014
Controlling the Sn grain morphology of SnAg C4 solder bumps
- Gregory Parks
- Minhua Lu
- et al.
- 2014
- ECTC 2014
Effect of Joule heating on electromigration reliability of Pb-free interconnect
- Minhua Lu
- Steven L. Wright
- et al.
- 2012
- ECTC 2012
The dependence of the Sn grain structure of Pb-free solder joints on composition and geometry
- Gregory Parks
- Babak Arfaei
- et al.
- 2012
- ECTC 2012
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Comparison between Field Effect Transistors and Bipolar Junction Transistors as Transducers in Electrochemical Sensors
- Sufi Zafar
- Minhua Lu
- et al.
- 2017
- Scientific Reports
Atomic-beam alignment of inorganic materials for liquid-crystal displays
- P. Chaudhari
- James Lacey
- et al.
- 2001
- Nature