A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
This article describes the design, fabrication, and thermal performance of 300-mm-diameter wafer-scale Si microchannel coolers that demonstrated a junction temperature rise of less than 18 °C when dissipating about 14 kW of power. A thermal test wafer, which included hot-spot regions to mimic high-power compute cores, was attached to the wafer-scale microchannel cooler with Pb-Sn solder. Glass manifold layers were attached to the microchannel wafer using a frit material. The average apparent heat transfer coefficient, happ, was about 104000 W/(K-m2).
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Kevin Brew, Injo Ok, et al.
MRS Fall Meeting 2022
Manuel Le Gallo
PASC 2025
Evan G. Colgan, Bruce Furman, et al.
IEEE Transactions on Components and Packaging Technologies