High-speed signaling performance of multilevel wiring on glass substrates for 2.5-D integrated circuit and optoelectronic integration
- Xiaoxiong Gu
- Renato Rimolo-Donadio
- et al.
- 2013
- ECTC 2013
Publications
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7 results for Lavanya Turlapati
2.5D and 3D technology challenges and test vehicle demonstrations
- John Knickerbocker
- Paul Andry
- et al.
- 2012
- ECTC 2012
Edge computing and contextual information for the internet of things sensors
- Lavanya Turlapati
- Nigel Hinds
- et al.
- 2017
- InterPACK 2017
High-density silicon carrier transmission line design for chip-to-chip interconnects
- Xiaoxiong Gu
- Lavanya Turlapati
- et al.
- 2011
- EPEPS 2011
An 8x10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2011
- VLSI Circuits 2011
Fabrication and Performance of 300-mm Wafer-Scale Silicon Microchannel Cooler
- Evan G. Colgan
- Kai Schleupen
- et al.
- 2023
- IEEE Transactions on CPMT
An 8x 10-Gb/s source-synchronous I/O system based on high-density silicon carrier interconnects
- Timothy O. Dickson
- Yong Liu
- et al.
- 2012
- IEEE Journal of Solid-State Circuits