Hulling Shang, Kam-Leung Lee, et al.
IEEE Electron Device Letters
Metal-gate FinFETs were fabricated using complete gate silicidation with Ni, combining the advantages of metal-gate and double-gate transistors. NiSi-gate workfunction control is demonstrated using silicide induced impurity segregation of As, P, and B over a range of 400 mV. High device performance is achieved by integrating the NiSi metal gate with an epitaxial raised source/drain, silicided separately with CoSi 2. Process considerations for this dual silicide integration scheme are discussed. Poly-Si gated FinFETs are also fabricated and used as references for workfunction and transconductance. © 2004 IEEE.
Hulling Shang, Kam-Leung Lee, et al.
IEEE Electron Device Letters
Anna W. Topol, Douglas C. La Tulipe Jr., et al.
IBM J. Res. Dev
Meikei Ieong
NMDC 2006
Leland Chang, Yang-Kyu Choi, et al.
IEEE Circuits and Devices Magazine