Conference paper
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
This paper provides the full HBM3 system interconnect signal integrity design, link budget analysis and a positive timing margin closure solution for the latest generation high density organic laminate capable of line widths and spaces of 1.5µ m. Also analyzed is the high density organic packaging scalability that includes inter-layer misregistration and dielectric thickness variations.
Max Bloomfield, Amogh Wasti, et al.
ITherm 2025
Xiaofan Zhang, Haoming Lu, et al.
MLSys 2020
Victor Chan, A. Gasasira, et al.
IEEE Trans Semicond Manuf
Juan Miguel De Haro, Rubén Cano, et al.
IPDPS 2022