Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging
- Ram Krishna
- Atom O. Watanabe
- et al.
- 2023
- ECTC 2023
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65 results for Frank Libsch
HBM3 Modules on Latest High Density Organic Laminate—Signal Integrity Design and Analysis with Interconnect Budget Results
- Frank R. Libsch
- Hiroyuki Mori
- 2023
- ECTC 2023
Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- Atom O. Watanabe
- Xiaoxiong Gu
- et al.
- 2023
- ECTC 2023
Issues and Solutions for On-chip Antenna Designs in High Resistivity Silicon
- Duixian Liu
- Arun Paidimarri
- et al.
- 2022
- AP-S/URSI 2022
Signal Integrity Design and Analysis with Link Budget Results of HBM2E Module on Latest High Density Organic Laminate
- Frank Libsch
- Hiroyuki Mori
- et al.
- 2022
- ECTC 2022
Packaging Issues and Solutions for Ultra-Low Power, High Efficiency GaN micro-LEDs for a Battery Free, Sub-mm2, Tetherless, Smart IoT System
- Frank R. Libsch
- S.W. Bedell
- et al.
- 2020
- IMAPS 2020
Dust-Sized High-Power-Density Photovoltaic Cells on Si and SOI Substrates for Wafer-Level-Packaged Small Edge Computers
- Ning Li
- Kevin Han
- et al.
- 2020
- Advanced Materials
Ultra-low-power sub-photon-voltage high-efficiency light-emitting diodes
- Ning Li
- Kevin Han
- et al.
- 2019
- Nature Photonics
Crypto anchors
- Venkat Balagurusamy
- Cyril Cabral
- et al.
- 2019
- IBM J. Res. Dev
Internet of the body and cognitive companion: Enabling high-quality monitoring of patients at home
- Rahel Straessle
- Yuksel Temiz
- et al.
- 2017
- Healthcom 2017