K.N. Tu
Materials Science and Engineering: A
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
K.N. Tu
Materials Science and Engineering: A
Julian J. Hsieh
Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
U. Wieser, U. Kunze, et al.
Physica E: Low-Dimensional Systems and Nanostructures
R.J. Gambino, N.R. Stemple, et al.
Journal of Physics and Chemistry of Solids