I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992
A low-cost, fully-integrated antenna-in-package solution for 60 GHz phased-array systems is demonstrated. Sixteen patch antennas are integrated into a 28 mm × 28 mm ball grid array together with a flip-chip attached transmitter or receiver IC. The packages have been implemented using low temperature co-fired ceramic technology. 60 GHz interconnects, including flip-chip transitions and via structures, are optimized using full-wave simulation. Anechoic chamber measurement has shown ∼ 5mm dBi unit antenna gain across all four IEEE 802.15.3c channels, achieving excellent model-to-hardware correlation. The packaged transmitter and receiver ICs, mounted on evaluation boards, have demonstrated beam-steered, non-line-of-sight links with data rates up to 5.3 Gb/s. © 2010 IEEE.
I.K. Pour, D.J. Krajnovich, et al.
SPIE Optical Materials for High Average Power Lasers 1992
A. Ney, R. Rajaram, et al.
Journal of Magnetism and Magnetic Materials
Joy Y. Cheng, Daniel P. Sanders, et al.
SPIE Advanced Lithography 2008
Sang-Min Park, Mark P. Stoykovich, et al.
Advanced Materials