Conference paper
High-throughput photonic packaging
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
In this work, we provide an overview of the technology and architecture of a microprocessor chip with optical I/O. Zero-change photonics integration enabled the chip to be fabricated in a commercial electronics CMOS foundry.
Tymon Barwicz, Ted W. Lichoulas, et al.
OFC 2017
Miloš A. Popovic, Mark T. Wade, et al.
SPIE OPTO 2015
Bo Peng, Chi Xiong, et al.
OFC 2017
Daniel M. Kuchta
OFC 2017