Conference paper
Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
Yves Martin, Swetha Kamlapurkar, et al.
ECTC 2017
We have demonstrated photonic packaging compatible with standard, high-throughput. microelectronics assembly lines. We show a 1.3dB fiber-to-chip loss and 1.1dB chip-to-chip loss. We discuss the rationale behind this approach and compare to other packaging directions.
Yves Martin, Swetha Kamlapurkar, et al.
ECTC 2017
Yves Martin, Jae Woong Nah, et al.
ECTC 2016
Jason S. Orcutt, Douglas M. Gill, et al.
OFC 2016
Tymon Barwicz, Yoichi Taira, et al.
GFP 2015