PaperSmall Signal Capacitance in Ferroelectric HZO: Mechanisms and Physical InsightsRevanth Kodoru, Atanu Saha, et al.arXiv
Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSoft x-ray investigation of the effect of growth conditions on InAs/GaAs heterostructuresA. Krol, C.J. Sher, et al.Surface Science