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A new family of highly sensitive negative resists for Deep UV, X-ray and electron beam exposure capable of better than 100 nm resolution and very high pattern aspect ration has been investigated. The resists are based epoxidized novolac resins sensitized with acid generating compounds. © 1990.
P. Alnot, D.J. Auerbach, et al.
Surface Science
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APS Global Physics Summit 2025
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