Terabus: A chip-to-chip parallel optical interconnect
J.A. Kash, F.E. Doany, et al.
LEOS 2005
The measured crosstalk characteristics for close-packed via fence enclosed differential stripline structures in a standard digital CMOS process are reported. The transmission lines achieve a packing pitch of 16 μm of interconnect width per differential pair. The nearest neighbour far-end differential crosstalk is measured to be better than -43 dB and the near-end differential crosstalk is better than -37 dB below the drive signal at frequencies up to 20 GHz for 600 μm lines. This is sufficient for use in high-density, high-speed analogue and digital integrated circuits. © IEE 2005.
J.A. Kash, F.E. Doany, et al.
LEOS 2005
A. Deutsch, R.S. Krabbenhoft, et al.
IEEE-SPI 2006
Y. Kwark, P. Solomon, et al.
IEEE/Cornell Conference on Advanced Concepts in High Speed Semiconductor Devices and Circuits 1989
D. Kuchta, C. Baks, et al.
IEEE Topical Meeting EPEPS 2005