Efficient Prediction of Equalization Effort and Channel Performance for PCB-Based Data Links
- Torsten Reuschel
- Jan B. Preibisch
- et al.
- 2017
- IEEE Transactions on CPMT
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54 results for Christian Schuster
Energy-Aware Signal Integrity Analysis for High-Speed PCB Links
- Sebastian Müller
- Torsten Reuschel
- et al.
- 2015
- IEEE Trans Electromagn Compat
An efficient hybrid finite-element analysis of multiple vias sharing the same anti-pad in an arbitrarily shaped parallel-plate pair
- Yao-Jiang Zhang
- Liehui Ren
- et al.
- 2015
- IEEE T-MTT
Proximity effects between striplines and vias
- Young H. Kwark
- Renato Rimolo-Donadio
- et al.
- 2014
- EMC 2014
Using via stubs in periodic structures for microwave filter design
- Andreas Hardock
- Young H. Kwark
- et al.
- 2014
- IEEE Transactions on CPMT
Application of vias as functional elements in microwave coupling structures
- Andreas Hardock
- Renato Rimolo-Donadio
- et al.
- 2013
- IEEE T-MTT
Signal and power integrity (SPI) co-analysis for high-speed communication channels
- Renato Rimolo-Donadio
- Xiaomin Duan
- et al.
- 2013
- DesignCon 2013
Analytical extraction of via near-field coupling using a multiple scattering approach
- Sebastian Muller
- Andreas Hardock
- et al.
- 2013
- SPI 2013
Complete modeling of large via constellations in multilayer printed circuit boards
- Sebastian Müller
- Fabian Happ
- et al.
- 2013
- IEEE Transactions on CPMT
Backplane channel design optimization: Recasting a 3Gb/s link to operate at 25Gb/s and above
- Xiaoxiong Gu
- Young H. Kwark
- et al.
- 2012
- DesignCon 2012