Opportunities and challenges for 3D systems and their design

Philip Emma; Eren Kursun

doi:10.1109/MDT.2009.119

IEEE Design and Test of Computers

Paper

06 Nov 2009

Opportunities and challenges for 3D systems and their design

View publication

Abstract

Editor's note article presents the system design opportunities offered by 3D integration, and it discusses the design and test challenges for 3D ICs, with various new design-for-manufacture and DFT issues. © 2009 IEEE.

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