Exploring the vulnerability of CMPs to soft errors with 3D stacked nonvolatile memory
- Guangyu Sun
- Eren Kursun
- et al.
- 2013
- ACM JETC
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19 results for Eren Kursun
Through silicon via aware design planning for thermally efficient 3-D integrated circuits
- Yibo Chen
- Eren Kursun
- et al.
- 2013
- IEEE TCADIS
Thermomechanical stress-aware management for 3D IC designs
- Qiaosha Zou
- Tao Zhang
- et al.
- 2013
- DATE 2013
Spatial and temporal thermal characterization of stacked multicore architectures
- Eren Kursun
- Jamil Wakil
- et al.
- 2012
- ACM JETC
Fast poisson solvers for thermal analysis
- Haifeng Qian
- Sachin S. Sapatnekar
- et al.
- 2012
- ACM TODAES
Exploring the vulnerability of CMPs to soft errors with 3D stacked non-volatile memory
- Guangyu Sun
- Eren Kursun
- et al.
- 2011
- ICCD 2011
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
- Yibo Chen
- Eren Kursun
- et al.
- 2011
- ISLPED 2011
Characterizing power and temperature behavior of POWER6-based system
- Víctor Jiménez
- Francisco J. Cazorla
- et al.
- 2011
- IEEE JESTCS
Energy-aware accounting and billing in large-scale computing facilities
- Víctor Jiménez
- Francisco J. Cazorla
- et al.
- 2011
- IEEE Micro
Exploring the effects of on-chip thermal variation on high-performance multicore architectures
- Chen-Yong Cher
- Eren Kursun
- 2011
- Transactions on Architecture and Code Optimization