J.F. Ziegler, W.K. Chu, et al.
Applied Physics Letters
It is demonstrated that by covering a tungsten surface with tungsten needles, the sputtering coefficient for He ions is reduced by a factor of 3 to 100. Also, this metal surface does not blister under He bombardment to doses of 2.8×1019 He/cm2, although a similar polished W surface blisters at 1/30 this dose. Sputtering yields have been determined for both monoenergetic and distributed energy He ion beams, and the angular distribution of sputtered ions is reported.
J.F. Ziegler, W.K. Chu, et al.
Applied Physics Letters
A.W. Kleinsasser, J.M.E. Harper, et al.
Thin Solid Films
R.B. Laibowitz, J.J. Cuomo
Journal of Applied Physics
W.A. Lanford, H.P. Trautvetter, et al.
Applied Physics Letters