D. Gupta, B. Amrutur, et al.
IEEE TAS
Two different refrigeration technologies developed for server applications are described. While mechanical vapor-compression systems solved the refrigeration problems in high end servers and few processor systems, advanced thermoelectric coolers were stated to offer promising solutions for sub-ambient operation of low-end servers, parallel processor systems and extending the temperature differentials in vapor-compression systems. Thin film thermoelectric coolers were described to be ideal for sub-ambient operation of complementary metal oxide semiconductor (CMOS) circuits.
D. Gupta, B. Amrutur, et al.
IEEE TAS
Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits
A. Miner, A. Majumdar, et al.
Applied Physics Letters
Sandip Kundu, Uttam Ghoshal
EDTC 1997