Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperHierarchical hydrodynamic flow confinement: Efficient use and retrieval of chemicals for microscale chemistry on surfacesJulien Autebert, Aditya Kashyap, et al.Langmuir
PaperBrillouin scattering investigation of paraelectric KH2PO4 near the tricritical pointR.W. Gammon, E. Courtens, et al.Physical Review B
