PaperElectron and hole mobility enhancement in strained SOI by wafer bondingLijuan Huang, Jack O. Chu, et al.IEEE Transactions on Electron Devices
PaperUndoped-body extremely thin SOI MOSFETs with back gatesAmlan Majumdar, Zhibin Ren, et al.IEEE Transactions on Electron Devices
Conference paperUltra-low leakage silicon-on-insulator technology for 65 nm node and beyondJin Cai, Amlan Majumdar, et al.IEDM 2007
