PaperHarmonic analysis in rheological property measurementThomas E. Karis, C. Mark Seymour, et al.Rheologica Acta
Conference paperSelf-assembling materials for lithographic patterning: Overview, status and moving forwardWilliam Hinsberg, Joy Cheng, et al.SPIE Advanced Lithography 2010
Paper(S)PEEC: Time- and Frequency-Domain Surface Formulation for Modeling Conductors and Dielectrics in Combined Circuit Electromagnetic SimulationsDipanjan Gope, Albert E. Ruehli, et al.IEEE T-MTT
