Summary Abstract: High performance packaging in microelectronics

Lawrence Suchow, Norman R. Stemple

JES

F.J. Himpsel, T.A. Jung, et al.

Surface Review and Letters

Andreas C. Cangellaris, Karen M. Coperich, et al.

EMC 2001

Kigook Song, Robert D. Miller, et al.

Macromolecules