Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
TalkDirect electrical access to the spin manifolds of individual lanthanide atomsGregory Czap, Kyungju Noh, et al.APS Global Physics Summit 2025
TalkAssessing wildfires hazards around the electric gridFernando Marianno, Wang Zhou, et al.INFORMS 2021
PaperIon beam patterning of block copolymer thin filmsRanulfo Allen, John Baglin, et al.J. Photopolym. Sci. Tech.
