Post Tungsten CMP Cleaning: Optimization for Cleaning Efficiency and Corrosion Reduction
- Wei-Tsu Tseng
- Pinlei Chu
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
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83 results for Donald Canaperi
Molecular Interactions in Copper Chemical Mechanical Planarization: A Phenomenological Study
- Mahadevaiyer Krishnan
- Donald F. Canaperi
- et al.
- 2024
- ECS J. Solid State Sci. Technol.
First Experimental Demonstration of MRAM Data Scrubbing: 80 Mb MRAM with 40 nm junctions for Last Level Cache Applications
- H. Wu
- V. Katragadda
- et al.
- 2021
- IEDM 2021
CMP Defect Reduction and Mitigation: Practices and Future Trends
- Wei-Tsu Tseng
- Carol Boye
- et al.
- 2021
- ASMC 2021
Novel low k Dielectric materials for nano device interconnect technology
- Son Van Nguyen
- Hosadurga Shobha
- et al.
- 2020
- VLSI-TSA 2020
Method for improving stability of plasma ignition in a multi-cathode magnetron PVD system
- Jessica Gruss-Gifford
- V. Mehta
- et al.
- 2020
- ASMC 2020
Advanced Arsenic Doped Epitaxial Growth for Source Drain Extension Formation in Scaled FinFET Devices
- Shogo Mochizuki
- B. Colombeau
- et al.
- 2018
- IEDM 2018
Process Challenges in Fully Aligned Via Integration for sub 32 nm Pitch BEOL
- Benjamin D. Briggs
- C.B. Pcethala
- et al.
- 2018
- IITC 2018
Modified ALD TaN Barrier with Ru Liner and Dynamic Cu Reflow for 36nm Pitch Interconnect Integration
- P. Bhosale
- J. Maniscalco
- et al.
- 2018
- IITC 2018
CMP development for Ru liner structures beyond 14nm
- Raghuveer Patlolla
- Koichi Motoyama
- et al.
- 2018
- ECS J. Solid State Sci. Technol.