A high reliability Metal Insulator Metal capacitor for 0.18 μm Copper technology
- M. Armacost
- A. Augustin
- et al.
- 2000
- IEDM 2000
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17 results for J. Heidenreich
Full copper wiring in a sub-0.25 μm CMOS ULSI technology
- D. Edelstein
- J. Heidenreich
- et al.
- 1997
- IEDM 1997
Modular 0.13 μm bulk CMOS technology for high performance and low power applications
- L.K. Han
- S. Biesemans
- et al.
- 2000
- VLSI Technology 2000
A high performance 0.13 μm copper BEOL technology with low-k dielectric
- R.D. Goldblatt
- B.N. Agarwala
- et al.
- 2000
- IITC 2000
Copper dual damascene wiring for sub-0.25 μm CMOS technology
- J. Heidenreich
- D. Edelstein
- et al.
- 1998
- IITC 1998
Chemical and physical aspects of multilayer resist processing
- J. Paraszczak
- E. Babich
- et al.
- 1989
- Proceedings of SPIE 1989
Characterization of water vapor plasma‐modified polyimide
- R.D. Goldblatt
- L. Ferreiro
- et al.
- 2003
- Journal of Applied Polymer Science
The Gaseous Electronics Conference radio-frequency reference cell: A defined parallel-plate radio-frequency system for experimental and theoretical studies of plasma-processing discharges
- P.J. Hargis Jr.
- K.E. Greenberg
- et al.
- 1994
- Review of Scientific Instruments
An isotope approach to characterization of microwave water plasma modified polyimide surfaces
- N.J. Chou
- A.D. Marwick
- et al.
- 1992
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Rastered laser light scattering studies during plasma processing: Particle contamination trapping phenomena
- Gary S. Selwyn
- J. Heidenreich
- et al.
- 1991
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films