Effect of contact implants on the patterning of tungsten damascene interconnects
- J.P. Gambino
- M.A. Jaso
- et al.
- 1996
- MRS Spring Meeting 1996
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18 results for Mark A. Jaso
Characterization of defects produced in TEOS thin films due to chemical-mechanical polishing (CMP)
- F.B. Kaufman
- S. Cohen
- et al.
- 1995
- MRS Spring Meeting 1995
A novel application of polyimide-W-AI/CU for VLSI interconnect
- R.V. Joshi
- L. Hsu
- et al.
- 1991
- VMIC 1991
A 0.5 μm fully scaled two-level metal fully planarized interconnect structure fabricated with X-ray lithography
- D. Moy
- L.K. Wang
- et al.
- 1990
- VLSI Technology 1990
Low-resistance submicron CVD W interlevel via plugs on Al-Cu-Si
- R.V. Joshi
- S.B. Brodsky
- et al.
- 1989
- VMIC 1989
Selective Wet and Dry Etching of Hydrogenated Amorphous Silicon and Related Materials
- I. Haller
- Y.H. Lee
- et al.
- 2019
- JES
Surface Modifications of Electronic Materials Induced by Plasma Etching
- G.S. Oehrlein
- S.W. Robey
- et al.
- 2019
- JES
Etch Selectivity of Silicon Dioxide over Titanium Silicide Using CF4/H2 Reactive Ion Etching
- Steve W. Robey
- Gottlieb S. Oehrlein
- 2019
- JES
Selective dry etching of germanium with respect to silicon and vice versa
- G.S. Oehrlein
- T.D. Bestwick
- et al.
- 2019
- JES
Electrical Properties of Chemical-Mechanical Polished Tetraethyl Orthosilicate Films with and Without Capping Layers
- S. Cohen
- M.A. Jaso
- et al.
- 2019
- JES