Electromigration path in Cu thin-film lines
- C.-K. Hu
- R. Rosenberg
- et al.
- 1999
- Applied Physics Letters
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50 results for K.Y. Lee
Extendibility of Cu damascene to 0.1 μm wide interconnections
- C.-K. Hu
- K.Y. Lee
- et al.
- 1998
- MRS Spring Meeting 1998
Fabrication of Cu interconnects of 50 nm linewidth by electron-beam lithography and high-density plasma etching
- Y. Hsu
- T. Standaert
- et al.
- 1998
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Electromigration in 0.25 μm wide Cu line on W
- C.-K. Hu
- K.Y. Lee
- et al.
- 1997
- Thin Solid Films
Negative differential conductance in strained Si point contacts and wires
- S.J. Koester
- K. Ismail
- et al.
- 1997
- Applied Physics Letters
Operation of a novel negative differential conductance transistor fabricated in a strained Si quantum well
- S.J. Koester
- K. Ismail
- et al.
- 1997
- IEEE Electron Device Letters
Novel three-terminal negative differential conductance device in silicon: The hot-electron phonon-emission field-effect transistor
- S.J. Koester
- K. Ismail
- et al.
- 1997
- DRC 1997
Room temperature operation of a quantum-dot flash memory
- J.J. Welser
- Sandip Tiwari
- et al.
- 1997
- IEEE Electron Device Letters
Negative differential conductance in lateral double-barrier transistors fabricated in strained Si quantum wells
- S.J. Koester
- K. Ismail
- et al.
- 1997
- Applied Physics Letters
Electrical characterization of Si/Si0.7Ge0.3 quantum well wires fabricated by low damage CF4 reactive ion etching
- K.Y. Lee
- S.J. Koester
- et al.
- 1997
- Microelectronic Engineering