Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009
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67 results for D.Y. Shih
The effects of Ag, Cu compositions and Zn doping on the electromigration performance of pb-free solders
- Minhua Lu
- Da-Yuan Shih
- et al.
- 2009
- ECTC 2009
Controlling the interfacial reactions in Pb-free interconnections by adding minor alloying elements to Sn-rich solders
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2008
- ECTC 2008
C4NP Cu-cored Pb-free flip chip interconnections
- Jae-Woong Nah
- Stephen L. Buchwalter
- et al.
- 2008
- ECTC 2008
50μm pitch Pb-free micro-bumps by C4NP technology
- Bing Dang
- Da-Yuan Shih
- et al.
- 2008
- ECTC 2008
Comparison of electromigration performance for Pb-free solders and surface finishes with Ni UBM
- Minhua Lu
- Paul Lauro
- et al.
- 2008
- ECTC 2008
Critical factors affecting the undercooling of Pb-free, flip-chip solder bumps and in-situ observation of solidification process
- Sung K. Kang
- Moon Gi Cho
- et al.
- 2007
- ECTC 2007
The influence of low level doping on the thermal evolution of SAC alloy solder joints with Cu pad structures
- Isabel De Sousa
- Donald W. Henderson
- et al.
- 2006
- ECTC 2006
Effect of intermetallics spalling on the mechanical behavior of electroless Ni(P)/Pb-free solder interconnection
- Yoon-Chul Sohn
- Jin Yu
- et al.
- 2005
- ECTC 2005
Injection molded solder technology for Pb-free wafer bumping
- P. Gruber
- D.Y. Shih
- et al.
- 2004
- ECTC 2004