Electrical characteristics of lossy interconnections for high-performance computer applications
- A. Deutsch
- G.V. Kopcsay
- et al.
- 1990
- SPIE Advances in Intelligent Robotics Systems 1990
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6 results for J. Cataldo
In‐plane solvent diffusion in a photosensitive polyimide
- Da‐Yuan Shih
- Sharon Nunes
- et al.
- 2003
- Journal of Applied Polymer Science
Factors Affecting the Interconnection Resistance and Yield in Multilayer Polyimide/Copper Structures
- Da-Yuan Shih
- Helen L. Yeh
- et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Thin-film interdiffusions in Cu/Pd, Cu/Pt, Cu/Ni, Cu/NiB, Cu/Co, Cu/Cr, Cu/Ti, and Cu/TiN bilayer films: Correlations of sheet resistance with Rutherford backscattering spectrometries
- D.Y. Shih
- C.A. Chang
- et al.
- 1991
- Journal of Applied Physics
The effect of solvent absorption on the electrical and dielectric properties of polyimide films
- D.Y. Shih
- J. Cataldo
- et al.
- 1990
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
A study of the chemical and physical interaction between copper and polyimide
- D.Y. Shih
- J. Paraszczak
- et al.
- 1989
- Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films