Novel elastomeric connector for packaging interconnections, testing and burn-in applications
- D.Y. Shih
- Brian Beaman
- et al.
- 1995
- ECTC 1995
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15 results for M. Norcott
Polyimide stress cushion for multichip glass-ceramic module packaging
- D.Y. Shih
- P. Palmateer
- et al.
- 1995
- ECTC 1995
Large format fabrication a practical approach to low cost MCM-d
- George E. White
- Eric Perfecto
- et al.
- 1994
- MCMC 1994
Low temperature selective area chemical vapor deposition of gold films: Growth and characterization
- P.F. Seidler
- S.P. Kowalczyk
- et al.
- 1992
- MRS Proceedings 1992
Thermally stable in-based ohmic contacts to p-type GaAs
- P.E. Hallali
- M. Murakami
- et al.
- 1991
- Gallium Arsenide and Related Compounds 1991
WNx Schottky diodes on plasma treated GaAs
- A. Paccagnella
- A.C. Callegari
- et al.
- 1991
- Journal of Applied Physics
Thermally stable ohmic contacts to p-type GaAs. IX. NiInW and NiIn(Mn)W contact metals
- P.E. Hallali
- Masanori Murakami
- et al.
- 1991
- Journal of Applied Physics
Properties of SiO2/Si/GaAs structures formed by solid phase epitaxy of amorphous Si on GaAs
- A.C. Callegari
- D.K. Sadana
- et al.
- 1991
- Applied Physics Letters
Low Au content thermally stable NiGe(Au)W ohmic contacts to n-type GaAs
- Naftali Lustig
- Masanori Murakami
- et al.
- 1991
- Applied Physics Letters
Thermally stable ohmic contacts to n-type GaAs. VI. InW contact metal
- H.-J. Kim
- Masanori Murakami
- et al.
- 1990
- Journal of Applied Physics