3-D silicon integration and silicon packaging technology using silicon through-vias
- John U. Knickerbocker
- Chirag S. Patel
- et al.
- 2006
- IEEE Journal of Solid-State Circuits
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29 results for L.P. Buchwalter
Development of next-generation system-on-package (SOP) technology based on silicon carriers with fine-pitch chip interconnection
- John U. Knickerbocker
- Paul S. Andry
- et al.
- 2005
- IBM J. Res. Dev
Characterization of water vapor plasma‐modified polyimide
- R.D. Goldblatt
- L. Ferreiro
- et al.
- 2003
- Journal of Applied Polymer Science
Organic Chemistry on a Polyimide Surface
- Richard R. Thomas
- Stephen L. Buchwalter
- et al.
- 2002
- Macromolecules
Relative adhesion measurement for thin film microelectronics structures
- L.P. Buchwalter
- 2000
- Journal of Adhesion
Tantalum, tantalum nitride, and chromium adhesion to polyimide: Effect of annealing ambient on adhesion
- L.P. Buchwalter
- K. Holloway
- 1998
- Journal of Adhesion Science and Technology
Reaction of polyaniline with NMP at elevated temperatures
- A. Afzali
- Stephen L. Buchwalter
- et al.
- 1997
- Polymer
XPS analysis of fluorinated polyimides
- L.P. Buchwalter
- 1996
- Journal of Adhesion Science and Technology
Thermomechanical deformation of 1 μm thick Cu-polyimide line arrays studied by scanning probe microscopy
- D.V. Zhmurkin
- T.S. Gross
- et al.
- 1996
- Journal of Electronic Materials
Chromium and tantalum adhesion to plasma-deposited silicon dioxide and silicon nitride
- L.P. Buchwalter
- 1995
- Journal of Adhesion Science and Technology