High performance 45-nm SOI technology with enhanced strain, porous low-k BEOL, and immersion lithography
- S. Narasimha
- K. Onishi
- et al.
- 2006
- IEDM 2006
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10 results for Carlos Fonseca
Mastering double exposure process window aware OPC by means of virtual targets
- Henning Haffner
- Zachary Baum
- et al.
- 2006
- SPIE Photomask Technology 2006
Characterization of imaging performance for immersion lithography at NA=0.93
- 2006
- SPIE Advanced Lithography 2006
Immersion lithography: New opportunities for semiconductor manufacturing
- Darío Gil
- Timothy A. Brunner
- et al.
- 2004
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
High-performance circuit design for the RET-enabled 65nm technology node
- Lars Liebmann
- Arnold Barish
- et al.
- 2004
- AMM 2004
Layout Optimization at the pinnacle of Optical Lithography
- Lars Liebmann
- Greg Northrop
- et al.
- 2003
- SPIE Advanced Microelectronic Manufacturing 2003
Optimum mask and source patterns to print a given shape
- Alan E. Rosenbluth
- Rama N. Singh
- et al.
- 2002
- Journal of Microlithography, Microfabrication and Microsystems
Methodology for generating exposure tool specification for alternating phase shift mask application for 70 nm node
- Kafai Lai
- Gregg Gallatin
- et al.
- 2002
- SPIE Advanced Lithography 2002
Critical impact of mask electromagnetic effects on optical proximity corrections performance for 45 nm and beyond
- Jaione Tirapu Azpiroz
- Alan E. Rosenbluth
- et al.
- 2007
- Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
Enabling the 70 nm technology node with 193 nm altPSM lithography
- Lars Liebmann
- Jennifer Lund
- et al.
- 2002
- Proceedings of SPIE-The International Society for Optical Engineering